• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    led lamp, and, led light emitting strip. a led lamp and a led lighting bar capable of emitting light over 4 (pi) are provided. the led lamp includes a housing (1) for the led lamp, a core column (5) with an exhaust tube (2) and a bracket (42), a led strip (6) with at least one chip led lighting 4 (pi), an exciter (7) and an electrical connector (8). the led lamp housing and the core column are vacuum sealed as well to form a vacuum seal chamber (13). the vacuum seal chamber is filled with a gas having a low viscosity coefficient and high heat conductivity. the support and the led lighting bar fixed to the support are accommodated in the vacuum seal chamber. the led lighting bar, the exciter and the electrical connector are connected electrically in order. the electrical connector and the external power source are electrically connected.
    公开号:BR112013005707B1
    申请号:R112013005707-6
    申请日:2011-09-01
    公开日:2021-03-30
    发明作者:Shichao Ge；Huabin Liu；Tiehan Ge
    申请人:Zhejiang Ledison Optoelectronics Co., Ltd；
    IPC主号:
    专利说明:

    Field of the Invention
    [001] The present invention relates to a field of lighting techniques, more particularly, to an LED light-emitting strip and a lamp using it. Background of the Invention
    [002] In the prior art, an LED lamp instead of an incandescent lamp is typically composed of one or more power-type LEDs, a metal-based PCB (MPCB), a heatsink with a series of dissipating fins , an exciter including a switched power source and a constant current device, a connecting member, an anti-glare lamp housing and an electrical connector. Currently, the luminescent efficiency of such a lamp has reached that of widely used energy-saving fluorescent lamps. The luminescent efficiency of the entire energy-saving fluorescent lamps is 40-70 lm / W, but the luminescent efficiency of the white LED element is already up to 130 lm / W. Therefore, the efficiency of the LED lamp needs to be further improved. The main problems for the current LED lamp are found in costs and sales prices that are too high, which are several times those of fluorescent energy-saving lamps in the condition of the same luminous flux, therefore it is difficult to popularize. The factor resulting in high cost is not caused by the LED chip itself, but by the expensive aluminum alloy heatsink, the exciter including a switched mode power source having a transformer and a constant current device as well as packaging LED. Such an exciter not only has a high cost, but it also has a low efficiency. In addition, this exciter additionally includes elements such as triode, transformer and electrolytic capacitor that has a short life that is not matched to that of the LED. The average rated life of these elements is less generally 25,000 hours, while the LED life should be up to 50,000-100,000 hours. That is to say, LED lamp in the prior art to replace the incandescent lamp has a relatively low luminescent efficiency of the entire light, very high cost, and not very long life. If the LED lamp is intended to replace the incandescent lamp and the energy saving fluorescent lamp being used extensively, and it becomes mainstream of general lighting, then its efficiency should be increased further, the cost should be significantly decreased, the life of service should be extended, and they should have substantially the same weight and volume as those of the incandescent lamp.
    [003] Light emitted from LED originates from PN LED junction. The PN junction is originally a 4π illuminant. In the prior art, in order to concentrate light or connect with a metal heatsink, the PN LED junction is arranged with a reflective layer, a reflective dome or a heatsink on one side of it, that is, the illuminating 4π original is made as 2π or less than illuminating 2π. Thus, rays of light 2π that are directed to the heat sink will come out of this after a single reflection, multiple reflections and several absorptions; while a part of 2π light rays that are directed towards a light-leaving surface, will also come out after reflection, multiple reflections and various absorptions, since this part of 2π light will be directed towards the heat sink, thereby decreasing greatly increases the light output rate of the PN junction, that is, the efficiency of the LED is decreased. Currently, an internal quantum efficiency of light emitted by the PN junction of the LED is already close to 90%, while external quantum efficiency of this is only about 30%. The phrase "internal quantum efficiency being 90%" means that within the PN junctions, only 10% of injected electrons are drained without generating a photon, while each 90% of injected electrons generates a photon. However, an important reason for "the external quantum efficiency being only about 30%" is that the PN junction originally emitting 4π light becomes a 2π illuminator. If the PN LED junction is capable of emitting 4π light, it will certainly significantly increase the luminescent efficiency of the LED.
    [004] With respect to this, research has been carried out previously. For example, Chinese Patent No. 200510089384.X describes that a single LED chip is suspended in a light transmitting substance, thus to allow the chip to emit 4π light. nHowever, this does not solve a chip heat dissipation problem. This chip is suspended without a backing plate and thus the power conductors on the chip have poor reliability. Thus, only a single small power chip can be used, and it is difficult to produce reliable light with sufficient output light flow. And for example in US Patent Application No. 2007/0139949, a plurality of small chips are installed in series on an expensive transparent thermally conductive substrate, such as sapphire, diamond, GaN, or an opaque thermally conductive substrate such as copper, SiO. Then, the LED lamp having an incandescent lamp shape is formed by connecting the substrate described above to a lamp head by thermally conductive lead wires and a support to dissipate heat, and providing a lamp housing to the outside of that, which is not vacuum sealed, but filled with air in it and communicated with the ambient atmosphere. As described in the previous US patent application, this transparent thermally conductive substrate such as sapphire and diamond is very expensive and difficult to be practical; and since copper, SiO and the like are not transparent, it is impossible to achieve 4π light emission. One way to dissipate heat for this type of lamp is chip ^ thermally conductive substrate ^ thermally conductive lead wire ^ thermally conductive support ^ lamp head. The heat-dissipating path ends at the lamp head, resulting in a difficulty in making a thermal connection and a limited heat-dissipating effect. If the lamp head has the exciter for the LED, then it will cause the heat-dissipating path to be broken and failed. In this condition, if the lamp is vacuum sealed, then the path to dissipate heat will also be interrupted. Therefore, it is difficult to produce practical light with sufficient light output.
    [005] In the prior art, most LED light bulbs employ LEDs of the type of power having a low voltage and a high current. Each LED chip has a PN junction, its operating current is as large as 0.35A, even several amps, and the electrical power from 1 W to several Watts and above is concentrated in the area of one to several square millimeters of the chip . Since the external quantum efficiency of this is only about 30%, in addition to an energy difference between the injected electron and the photon generated by it as well as an energy difference between the photon generated by the PN junctions and the starting photon finally, about 70% of the electrical energy will be transformed into heat. How to dissipate so much heat is always a critical problem as this type of power LED first appears. LED is a semiconductor device, and an increase in the temperature of PN junctions will cause the luminescent efficiency to decrease rapidly, even the burning of PN junctions. Today, heat dissipation is still a critical problem in this type of low voltage and high current power LED lighting, including LED lamps.
    [006] In order to solve the problem of heat dissipation, the LED lamp in the prior art mainly employs the passive metal heatsink having heatsink fins. The materials and forms for this heatsink as well as how to increase the convection heat exchange with air have been studied and described in the patents, for example, Chinese Patent No. 200510062323.4 and US Patents Nos. 6787999 and 7144135. This metal heatsink is typically made of aluminum alloy and has a large volume, heavy weight and a high price. It is one of the critical factors for high cost of the LED lamp in the prior art.
    [007] Instead of the metal heat sink described above, liquid heat dissipation has also been studied, for example, Chinese Patent Nos. 200810093378.5, 200910100681.8 and 200910101643.4. The LED was placed in a sealed lamp housing that is filled with thermally conductive liquid capable of transmitting light, which can be, for example, water, oil, glycol or other inert liquid. On the one hand, the liquid has a much lower coefficient of thermal conductivity than that of the metal. As an example, the coefficient of thermal conductivity of water is about 0.7W / (m.K), while the coefficient of thermal conductivity of the metal is 50-415W / (m.K). The thermal conductivity coefficient of the aluminum alloy, which is generally used in the LED lamp heat sink, is 96-226W / (m.K). It can be seen from the above that the liquid has a much lower thermal conductivity than that of the metal. On the other hand, as the viscosity coefficient of the liquid is very large, for example, water having 8937 μP of viscosity, it is difficult for them to create convection. Compared to the previous one, the liquid has poor effects of thermal conduction and convection heat dissipation. In addition, the use of liquid to dissipate heat also gives rise to problems such as electroanalysis of the liquid, erosion of the liquid to the LED, the failure of heat dissipation or even explosion caused by the formation of a layer of gas phase at a LED surface probably due to the phase transition of the liquid, the liquid contamination caused after the lamp housing breaks, and the heavy weight. Thus, it is not easy to practically use and popularize it.
    [008] Use of gas to dissipate heat has already been studied, instead of the metal described above (solid) and liquid for heat dissipation. For example, the LED lamp of Chinese Patent No. 201010176451.2 uses the nitrogen anion sealed in the lamp housing to dissipate heat. And for example, the LED lamp of Chinese Patent No. 200910250434.6 uses a mixed gas of nitrogen and argon sealed in the lamp housing to dissipate heat. These methods are not used practically until now. In addition to these LED lamps, other types of lamps (such as cold cathode fluorescent lamps) can dissipate heat by applying high thermal conductivity of gas (such as He or a gas mixed with He and H2), for example as described in Chinese Patent No. 200710148853.X. But it is difficult to create a limited convection, resulting in the limited effect of thermal conduction and dissipation, as the tube of the cold cathode fluorescent lamp has a large volume, which almost occupies the entire lamp housing. Therefore, it is not used practically today. And for example, metal halogen lamps also employ filling the lamp housing with gas such as nitrogen and / or hydrogen, as can be seen from Chinese Patent No. 200580039670.3. The incandescent lamp can also be filled with gas such as nitrogen and / or hydrogen. However, these lamps are different from the LED light.
    [009] In addition to the previous heat dissipation problem, the LED lamp in the prior art also has an excitation problem of transforming commercial high voltage power into low voltage and high current. As previously described, most LED lamps in the prior art are power type LEDs operating in the condition of direct current, low voltage and high current. Their operating voltages are in the range of several volts to tens of volts and their currents are in the range of 0.35A at several amps. The current incandescent lamp and energy saving fluorescent lamp for general lighting directly use commercial alternating current with a voltage of 110-230V. Thus, if it is intended to replace them directly, then an exciter including an AC / DC converter will be needed, thus to transform the alternating current with the high voltage into the direct current with the low voltage and a high current value. Such an exciter usually includes a switched power source with elements such as triodes, transformers and electrolytic capacitors, and a constant current circuit. Since the volume of the LED light to replace the incandescent lamp is not too large, the volume of the exciter and transformers should be kept as small as possible, while the difference between the input voltage and the output voltage is very large; this results in low efficiency for electrical transformation, typically 70% -80%. This reduces the luminescent efficiency of the entire light. Meanwhile, because its efficiency is low, it generates a lot of heat. Taking into account the heat generated previously by the exciter and the heat generated by LED, the temperature of the exciter will rise promptly, so this not only further decreases the efficiency of the exciter, but will also shorten the exciter's life. Elements such as triodes, transformers and electrolytic capacitors that are sensitive to temperature, are included in the exciter. When temperature rises, its efficiency, life and reliability will be significantly reduced. This makes the life of the LED lamp in the prior art not primarily dependent on LED, but on the exciter. In addition, the exciter containing the power source switched with the transformer and the constant current circuit has a complicated circuit and a high requirement on the elements, so the cost of this is high, which is another critical factor in driving the high price of the lamp of the prior art LED.
    [0010] In order to replace such an exciter, a technology called ACLED (alternating current LED) is being developed, as can be seen for example in Chinese Patent Nos. 200510020493.6 and 200610099185.1 and US Patent Nos. 7515248 and 7535028, as well as product AX3221 ET AL. A series of small current LED chips are connected in series in a similar way to a bridge rectifier circuit, installed over an MPCB, and provided with a heat sink. They can operate directly with commercial alternating current and the excitation circuit for this is relatively simple. However, such an LED currently has a relatively low efficiency, and needs to connect securely and thermally to a metal heatsink that has to be exposed in the air. Since ACLED is connected with a high alternating current voltage, the metal heatsink will be charged easily and thus will be unsafe. The prior art HVLED (high voltage LED), for example as described in Chinese Patent No. 201020159200.9, also has the same safety concerns.
    [0011] In addition, the LED is a type of point light source, and about 100 lm of light will be concentrated over an area of about 1 mm2, so an intensity of light will be up to around tens of millions of nits. If a person looks at it directly in the eye, it will create a strong glare, thus leaving a shadow in the field of view, so the view will be impacted strongly in a short time. Therefore, domestic lights should be provided with an anti-glare lamp housing or other devices to disperse light. In order to get a good feeling for the light, a light diffusing layer of the anti-glare lamp housing needs to be sufficiently thick, while this will also reduce the transmission efficiency of the lamp housing. This will typically lose about 15% light. This in turn reduces the luminescent efficiency of the entire light.
    [0012] Relative to the previous one, if the prior art LED light is intended to largely replace the incandescent lamp and the energy saving fluorescent light, for general lighting, then the LED light should have an additional improved luminescent efficiency, cost significantly reduced, a long life time, and volume and weight close to those of the incandescent lamp. Summary of the Invention
    [0013] Due to the above deficiencies in the prior art, an objective of the present invention is to alleviate at least one aspect of the previous problems and defects.
    [0014] Therefore, an objective of the present invention is to provide an LED light-emitting strip that is capable of emitting 4π light with a high efficiency.
    [0015] An objective of the present invention is to provide a highly efficient LED lamp with LED chips emitting 4π light with a high efficiency.
    [0016] Another objective of the present invention is to provide a highly efficient low cost LED lamp with LED chips emitting 4π light.
    [0017] An additional objective of the present invention is to provide a highly efficient long life LED lamp with LED chips emitting 4π light.
    [0018] An even further objective of the present invention is to provide a highly efficient LED lamp with LED chips emitting 4π light having a volume and weight close to that of an incandescent lamp.
    [0019] In accordance with an aspect of the present invention, an LED lamp is provided, including: an LED light lamp housing; a core column with an exhaust pipe and a support; at least one LED light-emitting strip with LED chips emitting 4π light on it; an driver; and an electrical connector, in which the LED light lamp housing is vacuum sealed with the core column thus to form a vacuum sealed chamber, which is filled with a gas having a low viscosity coefficient and a high coefficient of thermal conductivity, the bracket and the LED light-emitting strip attached to the bracket are housed in the vacuum sealed chamber, the LED-light-emitting strip is in turn electrically connected to the exciter, the electrical connector, and the electrical connector is used to connect electrically to an external power source, thus to illuminate the LED light-emitting strips.
    [0020] According to another aspect of the present invention, an LED light-emitting strip with LED chips emitting 4π light is provided, wherein the LED-light-emitting strip includes a transparent substrate and at least a series of LED chips in the transparent substrate connected in series in such a way that the PN junctions in it have the same direction, the LED chips having transparent chip substrates, electrodes of the LED chips being conducted by a conductive electrode device of the LED chips arranged at two ends of the transparent substrate, where the transparent substrate is made of soft glass, hard glass, quartz glass, ceramics or transparent plastics.
    [0021] In accordance with another aspect of the present invention, an LED light-emitting strip with LED chips emitting 4π light is provided, wherein the LED-light-emitting strip includes a transparent substrate and at least a series of LED chips in the transparent substrate connected in series in such a way that the PN junctions in it have the same direction, the LED chips having transparent chip substrates, electrodes of the LED chips being conducted by an electrode conducting device of the LED chips arranged at two ends of the transparent substrate, where part of the LED chips are blue light LED chips, while the other part of these are red light LED chips, a layer of luminescent phosphor powder is arranged around the LED chips and the transparent substrate on which the LED chips are installed to convert a portion of the blue light emitted from the LED chips into yellow light, while the other portion of blue light is mixed with the yellow light and the red light p to create clear white light, while light having a high color rendering index or other colored light.
    [0022] In accordance with another aspect of the present invention, an LED light emitting strip with LED chips emitting 4π light is provided, wherein the LED light emitting strip includes a transparent substrate and at least a series of LED chips in the transparent substrate connected in series in such a way that the PN junctions in it have the same direction, the LED chips having transparent chip substrates, electrodes of the LED chips being conducted by an electrode conducting device of the LED chips arranged at two ends of the transparent substrate, in which a transparent tube or a tube of transparent luminescent phosphor powder is included on the outer side of the LED chips and the transparent substrate.
    [0023] According to another aspect of the present invention, an LED light emitting strip with LED chips emitting 4π light is provided, wherein the LED light emitting strip includes a transparent substrate and at least a series of LED chips in the transparent substrate connected in series in such a way that the PN junctions in it have the same direction, the LED chips having transparent chip substrates, electrodes of the LED chips being conducted by an electrode conducting device of the LED chips arranged at two ends of the transparent substrate, where the LED chips are transparent high voltage LED chips, each of which includes at least two PN LED junctions connected in series.
    [0024] A highly efficient LED lamp with LED chips emitting 4π light in the present invention includes a light transmitting lamp housing, a core column with an exhaust tube, a power conductor and a bracket, at least one LED light-emitting strip with LED chips emitting 4π light, an exciter, an electrical connector, a lamp housing and a connecting member to connect to the electrical connector, the light transmitting lamp housing and the core column are vacuum sealed to form a vacuum sealed chamber, which is filled with a gas having a low coefficient of viscosity and a high coefficient of thermal conductivity; the lamp housing, the LED light strip, the exciter, the electrical connector and the connecting member are electrically connected together to form an entire lamp; the LED light emitting strip is attached to the core column, electrodes of the LED light emitting strip are connected to the exciter and the electrical connector by the core column power conductor, and finally connected to the external power source to turn on the external power source, that is, illuminate the LED light-emitting strip.
    [0025] It can be known from the previous that in the present embodiment, the LED lamp transmitting light is vacuum sealed with the core column, thus to house the corresponding support and the LED light-emitting strip attached to it. In addition, the exciter and electrical connector are arranged outside the vacuum sealed chamber.
    [0026] The vacuum sealed chamber formed by the light transmitting lamp housing and the core column is filled with gas having a low coefficient of viscosity and a high coefficient of thermal conductivity, for example, He, H2, or a mixed He and H2 gas. At room temperature, the gas has a gas pressure in the range of 50-1520 Torr. It is known that any static gas is a good thermal insulator, and the heat dissipation of the gas is mainly dependent on convection. That is, it is necessary to select a gas having a low viscosity coefficient. Helium has the lowest viscosity coefficient, which is only 116 μP (that of H2 is 173 μP, that of air is 922 μP, and that of water is 8937 μP), among the gases, thereby easily forming an efficient convection of heat dissipation. On the other hand, the LED light-emitting strip has a small volume and is easier to form an efficient gas convection, thereby effectively removing heat generated when the LED light-emitting strip is working, by convection and conduction of heat from the gas and the lamp housing. In addition, the LED light-emitting strip is protected by inert gas such as He or another gas having a low viscosity coefficient, and vacuum sealed. Since the LED light-emitting strip is completely unaffected by water vapor, etc., in the surrounding environment, the LED light-emitting strip and the LEDS chips in it have a long life span.
    [0027] The LED light emitting strip with the LED chips emitting 4π light includes a transparent substrate, and at least a series of LED chips on the transparent substrate connected in series in such a way that PN junctions have the same direction. LED chips have transparent chip substrates, and are fixed to the transparent substrate using transparent glue, such as silicone glue, modified resin or epoxy resin and the like. The LED chip emits 4π light, and has a high luminescent efficiency. LED electrodes are conducted through power conductors at two ends of the transparent substrate.
    [0028] The transparent substrate of the LED light-emitting strip is made of glass, hard glass, quartz glass, ceramics or transparent plastics and the like. The power conductors at both ends of the LED light-emitting strip are attached to both ends of the transparent substrate by high-temperature glue, plastics, silver paste or low-melting glass.
    [0029] The at least one series of LED chips is fixed separately on the transparent substrate to each other. The respective chips can be arranged adjacent to each other, or they can be spaced apart by a certain distance. For example, the distance between the chips is greater than 0.01 mm. The heat generated when LED is working is distributed dispersively and is easy to dissipate. LED has a small temperature rise and long service life. Since light emitted from LEDs is dispersively distributed, LED glare is reduced.
    [0030] Chips connected in series that are installed on the transparent substrate can be LED chips with identical or different luminescent colors, for example, emitting identical blue light, ultraviolet or other monochromatic light. The chips can also be three primary colors of RGB or multiple primary colors, so to obtain white light or different colored mixed light. When different numbers of LEDs having multiple luminescent colors are selected, it is possible to obtain white light having a high color rendering index.
    [0031] A transparent dielectric layer having high light transmittivity and high refractive index, for example, silicone glue, plastics or epoxy resin, can be placed on a transparent substrate surface of the LED light-emitting strip installed with chips and on the chips, thereby increasing the light output efficiency and protecting the LED chips and the electrical connection wires therefrom.
    [0032] When LED chips emit blue light or ultraviolet light, and need luminescent phosphor powder to convert it into white light or other colored light, a layer of uniform luminescent phosphor powder outside the light-emitting strip and the chips are also needed.
    [0033] Luminescent phosphor powder can be covered on exterior surfaces around the transparent substrate and chips.
    [0034] The luminescent phosphor powder layer can be covered on the outer surface around the transparent substrate of the light emitting strip and a surface installed with the chips as well as the transparent dielectric layer on the chips.
    [0035] A transparent dielectric layer can be covered first around the transparent substrate of the light-emitting strip and the chips, and then a layer of uniform luminescent phosphor powder is covered in it.
    [0036] A layer of uniform luminescent phosphor powder can be covered first around the transparent substrate of the light-emitting strip and the chips, and then a transparent dielectric layer is covered in it.
    [0037] The luminescent phosphor powder layer is made by mixing the luminescent powder and the transparent dielectric, which is highly light transmissive, highly refractive and heat conductive, for example, silicone glue, epoxy resin, plastics, transparent glue , transparent lacquer and organic macromolecular material and so on.
    [0038] The luminescent phosphor powder and the transparent dielectric are mixed in advance to produce a uniform luminescent film, which is then wrapped around the transparent substrate and the transparent dielectric layer on the chips.
    [0039] The luminescent phosphor powder layer, which is made by mixing the luminescent phosphor powder with the transparent dielectric, can also be made as a tube of transparent dielectric phosphor powder. The tube of luminescent phosphor powder can be placed outside the transparent substrate and chips. The transparent dielectric can be, for example, silicone glue, epoxy resin, plastics and glass and so on.
    [0040] Luminescent phosphor powder can also be covered over an inner or outer wall of a glass tube, and made like a luminescent glass phosphor powder tube. And then the transparent substrate installed with at least a series of LED chips can be placed inside the glass tube of luminescent phosphor powder.
    [0041] A dielectric having high transmissivity for light, high coefficient of thermal conductivity and high refractive index, for example, silicone glue, epoxy resin, plastics and so on, can be filled between the tube of dielectric luminescent phosphor powder transparent or the luminescent glass phosphor powder tube and the LED chips and the transparent substrate. Two ends of the front transparent dielectric phosphor powder tube or the glass luminescent powder tube can be attached or sealed with the power conductor to both ends of the transparent substrate.
    [0042] The luminescent phosphor powder can also be covered on the inner wall of the transparent lamp housing.
    [0043] The LED light strip with LED chips emitting 4π light has at least one series of LED chips connected in series, which can be high voltage LED chips. Each of the high voltage LED chips includes at least two PN LED junctions connected in series, any two of which have at least one electrical connection wire. At least one metal electrode for welding and bonding wire is provided at two ends of each high voltage LED chip. At least one electrical connection wire is provided between any two high voltage LED chips, and between the high voltage LED chip and a high voltage LED power conductor. Since each high voltage LED chip has a plurality of LED PN junctions, the number of chips needed by the light-emitting strip is significantly reduced, thereby simplifying the matrix bonding and wire bonding process of the emitting strip of light, and improving the performance of the light-emitting strip produced. In the meantime, it is not necessary for the LED PN junctions to have a large area of an opaque metal welding disc, and thus the light-starting efficiency is improved, that is, increasing the light emission efficiency.
    [0044] The various LED light-emitting strips described above with LED chips emitting 4π light in them, can not only be used to manufacture the present LED lamp, but can also be used as an individual light emitting element.
    [0045] The at least one series of LED chips connected in series in such a way that the PN junctions have the same direction, has sufficient numbers that a total excitation voltage of the at least one LED light emitting strip used after be connected in series or in series-parallel, is close to an externally commercial AC voltage or a voltage from an external DC power source, for example, 20-100% of a peak value of the AC voltage used or the DC power source. Therefore, the transformer is not necessary for the exciter, and so the present invention provides a simple circuit, a high efficiency, and a low cost.
    [0046] The at least one LED light emitting strip having the LED chips emitting 4π light on it is connected in series or in connected in series-parallel, so that they can operate in bidirectional AC mode or unidirectional DC mode .
    [0047] The arrangement of at least one light-emitting strip is in the shape of a V, W, column, cone, or plane, ET AL.
    [0048] In order to avoid the generation of shadow in the lamp housing caused by blocking light emitted from an LED light emitting strip by means of another LED light emitting strip, the respective of the at least one light emitting strip intertwine each other. That is, any two strips of the various LED light-emitting strips are not located on the same plane.
    [0049] The various strips of the LED light-emitting strips intertwine with each other, on the diagonal line of the respective faces of a virtual polyhedral column or polyhedral truncated cone.
    [0050] When at least one LED light-emitting strip is connected to operate in bidirectional AC mode, at least one of the LED light-emitting strips is conducted in a forward direction, while at least one additional of the LED-emitting strips LED light is conducted in a reverse direction. Conversion of alternating forward and reverse AC in direction causes the strips in exchange to be conducted, thereby emitting light. Certainly, at least 5 LED light-emitting strips are arranged to form a circuit similar to the bridge rectifier circuit. Just like the available ACLED, alternate forward and reverse AC conversion in direction causes the strips in return to be conducted to emit light. The light-emitting strip is sealed in the vacuum-sealed light transmitting lamp housing, and the high operating voltage is also isolated by or inside the lamp housing. Hereby, it is possible to use commercial CA directly. Of course, it is also possible to only connect a voltage reduction, limiting circuit or current regulator in series with the resistor and capacitor being connected in parallel, or PTC, ET AL resistor. Therefore, the LED light-emitting strip is safe and reliable, overcoming the defects of easily supporting high voltage and being insecure like the current ACLED and HVLED heatsink.
    [0051] When at least one LED light-emitting strip is connected to operate in unidirectional DC mode, it can work with an external DC power source or AC power source. When using the external AC power source, the exciter can be composed of a rectifier and filter circuit and a current limiting circuit lowering having a capacitor and resistor connected in parallel or can use a rectifier and filter circuit or a circuit rectifier connected in series with a PTC resistor. The exciter has a simple circuit, a low cost, no triode, no transformer, no high frequency radiation and / or no electrolytic capacitor. The exciter can be a relatively simple non-isolated exciter with an inductance and a constant current source, without a transformer.
    [0052] The light transmitting lamp housing is transparent, or it is milky, matte or colored, or a part of the lamp housing has a reflective layer or a series of small prisms or lens.
    [0053] The light transmitting lamp housing has a shape of any type A, G, R, PAR, T, candle, P, PS, BR, ER, or current lamp housing BRL.
    [0054] The electrical connector is any of the electrical connectors of types E40, E27, E26, E14, GU, BX, BA, EP, EX, GY, GX, GR, GZ, and G of the current lamp.
    [0055] When compared with the prior art, the present invention has the following advantages: - High luminescent efficiency. The gas having a low viscosity coefficient, which is sealed inside the vacuum sealed lamp, is used to perform convection heat dissipation, thereby solving the heat dissipation problem of LED chips emitting 4π light. When chips emit 4π light, luminescent efficiency is increased by more than 65%. When using the high voltage LED light strip with a plurality of LED chips being connected in series, the efficiency of the exciter circuit is up to more than 95%. The efficiency of the entire lamp can be up to more than 130 lm / W, which is once the current LED lamp, twice the energy-saving fluorescent lamp, and ten times the incandescent lamp. If high voltage LED chips with LED chips emitting 4π light are used, luminescent efficiency will be further improved. - A low cost. The heat generated by the LEDs when working is removed by convection and gas conduction having a low viscosity coefficient and a high heat conduction coefficient inside the vacuum sealed lamp housing and the lamp housing, without the need for the heat sink of metal. When using the high voltage LED light strip, you do not need a high cost AC / DC converter with a transformer. The cost of the entire lamp is reduced by two thirds or more. If high voltage LED chips with LED chips emitting 4π light are used, then the cost of this can be further reduced. - A long life. The entire light does not include any short-lived element devices. Since the LED is located inside a vacuum-sealed lamp housing filled with inert gas He, it is completely unaffected by water vapor, etc., within the surrounding environment. In addition, the chips are installed dispersively and work on a small current and at a low temperature. The service life of the LED lamp can be achieved with a long life of the LED itself, ie 50,000-100,000 hours. - Security and reliability. The high-voltage LED light-emitting strips with the high operating voltage for this purpose are sealed in the vacuum-sealed lamp housing. Therefore, they are safe and reliable, solving the current ACLED and HVLED security problems. - Low weight and small volume. Since the entire LED light does not need the metal heatsink and the transformer, the weight of the light is reduced by two thirds or more. The LED light in the present invention is lighter than the energy-saving fluorescent lamp, and its weight is close to that of the incandescent lamp. The volume of the present LED light is also close to that of the incandescent lamp. - Weak glare. A plurality of today's small LED chips are dispersively distributed, reducing glare from LED chips.
    [0056] As the internal quantum efficiency of LED chips is further improved, and the chip price is continually decreased, the LED lamp with LED chips emitting 4π light from the present invention can become a primary form of the general lighting lamp LED.
    [0057] The present LED lamp can directly replace the incandescent lamp and the energy-saving fluorescent light, for the purpose of lighting. Brief Description of the Drawings
    [0058] These and / or other aspects and advantages can be apparent and readily understood from the following description of the preferred embodiment, in combination with the accompanying drawings, in which: Figure 1 is a schematic structure view of a highly efficient LED lamp with chips LEDs emitting 4π light as an embodiment of the present invention; Figure 2 is a schematic view of a highly efficient LED lamp with LED chips emitting 4π light according to another embodiment of the present invention; Figure 3 is a schematic view of a highly efficient LED lamp with LED chips emitting 4π light as a further embodiment of the present invention; Figure 4 is a schematic view of a highly efficient LED lamp with LED chips emitting 4π light as an even further embodiment of the present invention; Figure 5 is a schematic view of a highly efficient LED lamp with LED chips emitting 4π light as an even further embodiment of the present invention; Figure 6 is a front view of a schematic structure of the LED light-emitting strip on the highly efficient LED lamp with LED chips emitting 4π light in accordance with an embodiment of the present invention; Figure 7 is a schematic structure view of the light-emitting strip taken along a line A-A of Figure 6 in accordance with an embodiment of the present invention; Figure 8 is a schematic structure view of the light-emitting strip taken along a line A-A of Figure 6 in accordance with another embodiment of the present invention; Figure 9 is a schematic view of the light-emitting strip taken along a line A-A of Figure 6 in accordance with a further embodiment of the present invention; Figure 10 is a schematic view of the light-emitting strip taken along a line A-A of Figure 6 in accordance with a still further embodiment of the present invention; Figure 11 is a schematic structure view of the light-emitting strip taken along a line A-A of Figure 6 in accordance with a still further embodiment of the present invention; Figure 12 is a schematic structure view of the light-emitting strip taken along a line A-A of Figure 6 in accordance with a further embodiment of the present invention; Figure 13 is a schematic view of the light-emitting strip taken along a line A-A of Figure 6 in accordance with a further embodiment of the present invention; Figure 14 is a schematic front view of the LED light-emitting strip on the highly efficient LED lamp with LED chips emitting 4π light in accordance with an embodiment of the present invention; Figure 15 is a schematic view of the light-emitting strip taken along a line B-B of Figure 14 in accordance with an embodiment of the present invention; Figure 16 is a front view of a schematic structure of an LED light-emitting strip with high voltage LED chips emitting 4π light in accordance with an embodiment of the present invention; Figure 17 is a schematic view of another arrangement of the LED light-emitting strip in the highly efficient LED lamp with LED chips emitting 4π light in accordance with an embodiment of the present invention; Figure 18 is a schematic view of another arrangement of the LED light-emitting strip in the highly efficient LED lamp with LED chips emitting 4π light in accordance with an embodiment of the present invention; Figure 19 is a schematic view of another arrangement of the LED light-emitting strip in the highly efficient LED lamp with LED chips emitting 4π light in accordance with an embodiment of the present invention; and Figure 20 is a schematic view of another LED light emitting strip arrangement in the highly efficient LED lamp with LED chips emitting 4π light in accordance with an embodiment of the present invention.
    [0059] A brief explanation is given below for the reference numbers used in the accompanying drawing. 1. 1a light transmitting lamp housing. extended core column tube 2. exhaust tube 2a. exhaust pipe sealing location 3. electrical power conductor 3a. curved electrical power conductor 4. pillar 42. support 5. core column 6. 6a, 6b. LED light-emitting strip 7. exciter 8. electrical connector 9. connection piece 10. LED lamp 11. 11a. metal wire in core column 12. electrical connection wire 13. vacuum sealed chamber 14. light reflective layer 14a. light reflecting plate 15. transparent substrate 16. 16a. LED chip 17. electrical connection wire between chips 18. electrode conductor; 19. fixing means for electric power conductor 20. welding end of electric power conductor 21. electrical connection wire 22. transparent glue 23. starting light 24. junction PN 25. 25th transparent dielectric layer 26. 26th layer of luminescent phosphor powder 27. light emitting strip with transparent tube or luminescent phosphor powder tube 28. transparent tube or luminescent phosphor powder tube 29. electrical power conductor 30. sealing location 31. transparent dielectric 32. layer of luminescent phosphor powder 33. light emitting strip of high voltage LED chip 34. high voltage LED chip 35. PN junction of LED 36. electrical connection wire between PN 37 junctions. union disk at two chip ends high voltage LED strip 38. electrical connection wire between high voltage LED chip and / or electrical connection wire between high voltage LED chip and power conductor 39. cone shaft 40. colored LED light strip different 41. polyhedron virtual Detailed Description of Embodiments of the Invention
    [0060] The technical solution of the present invention will be explained further in detail, by the following embodiments, with reference to Figures 1-20. Throughout the specification, the same or similar reference numerals will indicate the same or similar components. The explanation for the implementation of the present invention with reference to the accompanying drawing is intended to interpret the general inventive concept of the present invention, instead of limiting the present invention.
    [0061] With reference to Figure 1, it is a schematic structure view of a highly efficient LED lamp with LED chips emitting 4π light as an embodiment of the present invention. This LED lamp includes an LED light transmitting lamp housing 1, a core column 5 with an exhaust tube 2 and a holder, at least one LED light emitting strip 6 having an LED chip emitting light 4π, an exciter 7, an electrical connector 8, a connection piece 9 connecting the lamp housing 1 to the electrical connector 8. The LED light transmitting lamp housing 1, the core column 5, the emitting strip LED light 6, exciter 7, electrical connector 8 and connection piece 9 are connected together and as an integral LED lamp 10. The LED light strip 6 is attached to the core column 5 by a conductor of electrical power 3 and a metal wire 11. Electrodes of the LED light strip 6 are in exchange connected to exciter 7, an electrical connection wire 12 (if needed), electrical connector 8 and an external power source through electrical power conductor 3 and / or the metal wire 11 of the core column 5. When the source d and external power is turned on, the LED light-emitting strip 6 is illuminated. The LED light transmitting lamp housing 1 and the core column 5 constitute a vacuum sealed chamber 13 by means of vacuum sealing. Chamber 13 is filled with a gas having a low viscosity coefficient and a high thermal conductivity coefficient that can remove heat generated by the LED light strip 6 when the LED light strip 6 is operating, by convection and conduction of the gas and the light transmitting LED lamp housing 1.
    [0062] It should be understood that as shown in Figure 1, a pillar 4, the power conductor 3 and the metal wire 11 are used as a support 42 to fix the LED light-emitting strip 6. In the present embodiment, the core column 5 includes the exhaust pipe 2, the enlarged pipe 1a, and the support 42 (which includes the power conductor 3, the pillar 4 and the metal wire 11) integrated with each other. As described above, the core column 5 is vacuum sealed with the LED lamp housing 1. Specifically, the extended tube 1a is vacuum sealed with the LED lamp housing 1 at the joined location thereof. As understood by the person skilled in the art, the core column of the present embodiment is arranged in the same way as various components of the prior art core column, so the detailed description for the core column is omitted.
    [0063] Specifically, the LED lamp housing 1 and the core column 5 are fused in positions joined by a high temperature heating process, thereby forming a vacuum sealed chamber 13. The process used in the present embodiment is identical to the sealing process used in traditional incandescent lamps. The LED light-emitting strip 6, the pillar 4 of the core column 5, and the metal wire / connecting wire 11 between one end of the electrical power conductor 3 and the light-emitting strip 6 are completely sealed in the sealed chamber vacuum 13; the vacuum sealed chamber 13 is filled with a gas having a low coefficient of viscosity and a high coefficient of thermal conductivity after being evacuated by the exhaust pipe 2; and then the exhaust pipe 2 is melted at the sealed location 2a to seal the gas inside the chamber 13. The gas having a low viscosity coefficient and a high thermal conductivity coefficient inside the vacuum sealed chamber 13, is for example, He , H2, or a mixed gas of He and H2, a pressure of which is in the range of 50-1520 Torr, at room temperature. Helium has the lowest viscosity coefficient among various gases, which is only 116 μP (when compared, that of H2 is 173 μP, that of air is 922 μP, that of water is 8937 μP). Therefore, Helium is easy to perform efficient convection dissipation, so to remove heat generated by the LED light emitting strip when it is operating, to ensure the normal operation of the LED light emitting strip.
    [0064] As can be seen from the previous one, the vacuum sealed chamber 13 only includes the LED light-emitting strip 6, the pillar 4 of the core column 5, and the metal wire / connecting wire 11 between one end of the power conductor 3 and the light-emitting strip 6. The electrodes at both ends of the LED-light-emitting strip 6 are in turn electrically connected to the exciter 7, the electrical connection wire 12 and the electrical connector 8 outside the sealed chamber a vacuum 13 by the power conductor 3 in the core column 5. The electrical connector 8 is used to connect the external power source, as well to illuminate the LED light strip 6.
    [0065] The LED light-emitting strip 6 is protected by inert gases such as He or another gas having a low viscosity coefficient, and vacuum sealed, thereby being completely unaffected, for example by water vapor, etc., within the surrounding environment. This will extend the life of the LED.
    [0066] The LED light emitting strip 6 has at least one series of PN junctions that are connected in series with each other in such a way that PN junctions have the same direction. The number of the LED chip is large enough that an overall excitation voltage of the at least one LED light emitting strip used after being connected in series or in series - parallel is close to the external AC voltage or a voltage of the power source. external DC power, for example, in the range of 20-100% of a peak value of the AC voltage used or the voltage of the DC power source. Hereby, as for the resulting high voltage LED light strip with the LED chip emitting 4π light, there are the following advantages: the exciter does not need the transformer, the circuit is simplified, efficiency is improved and the cost is low.
    [0067] At least one LED light emitting strip 6 can be connected in series or in series-parallel, so that they can operate in bidirectional AC mode or unidirectional DC mode. Figure 1 shows an example in which two LED strips are connected in series thus to operate in unidirectional DC mode.
    [0068] When at least one LED light emitting strip 6 is connected to operate in unidirectional DC mode, the external power source for this can be either a DC power source or an AC power source. When using the external AC power source, exciter 7 can be composed of a current limiting circuit lowering having a capacitor and resistor connected in parallel and a rectifier and filter circuit, or can use a rectifier and filter circuit or a rectifier circuit connected in series with a PTC resistor without a triode, transformer, and / or electrolytic capacitor, or can employ a constant current device without changing the power source and a transformer. Therefore, the exciter has a low cost.
    [0069] When at least one LED light emitting strip 6 is connected to operate in bidirectional AC mode, at least one of the LED light emitting strip is driven in the forward direction, while at least one additionally of the LED emitting strip LED light 6 is conducted in the reverse direction. Conversion of alternate forward and reverse AC in direction causes the strips in exchange to be conducted alternatively to emit light. Of course, it is also possible that at least 5 light emitting strips of LED 6 are arranged to form a circuit similar to the bridge rectifier circuit. That is, 4 light-emitting strips are in turn conducted through alternating forward and reverse AC conversion in 4 arms, to emit light, while a strip connected diagonally to the 4 arms is always conducted to emit light, if AC is in the forward direction or in the reverse direction.
    [0070] When the light-emitting strips are operating in bidirectional AC mode, they can work directly through commercial AC, or exciter 7 is only PTC resistors or current limiting resistors connected in series.
    [0071] The LED light emitting strip having the LED chips emitting 4π light can be a high voltage LED light emitting strip, and the working environment with a high operating voltage is vacuum sealed in the lamp housing LED that has been vacuum sealed. Therefore, the high voltage LED light-emitting strip present is safe and reliable.
    [0072] The light transmitting lamp housing 1 is transparent, or is milky, matte or colored. Certainly, a part of the lamp housing can have a reflective layer or a series of small prisms or lens, as required.
    [0073] The light transmitting lamp housing 1 may have the shape of A, G, R, PAR, T, S, candle, P, PS, BR, ER, BRL, or any other shape of the lamp housing of the current lamp.
    [0074] The electrical connector 8 can be any of the electrical connectors of the current lamps such as types E40, E27, E26, E14, GU, B22, BX, BA, EP, EX, GY, GX, GR, GZ, and G , so to adapt to fix in different lamp receptacles or lighting adjustment. Figure 1 shows an example of the type E light head.
    [0075] Please note that in the following embodiments of the present invention, reference numerals identical to those used in Figure 1 indicate identical or functionally similar elements. For convenience, they are not described again in the following embodiments, unless they carry a different structure or function.
    [0076] Figure 2 is a schematic view of a highly efficient LED lamp with the LED chips emitting 4π light according to another embodiment of the present invention. In Figure 2, in order to prevent the generation of shadow in the LED lamp housing 1 (hereinafter called the lamp housing 1) or in the lighting adjustment caused by blocking light emitted from an LED light emitting strip by means of a another LED light-emitting strip, several LED light-emitting strips intertwine with each other. That is, any two strips of the various LED light-emitting strips are not located on the same plane. In the present embodiment, the LED light-emitting strip 6 has two LED light-emitting strips 6a and 6b, the lower ends (adjacent to one end of the exhaust tube 2) of which are located on the same horizontal plane (or at the same horizontal plane) height level) of Figure 2, while the upper ends of this are installed ahead and behind.
    [0077] Figure 3 is a schematic view of a highly efficient LED lamp with LED chips emitting 4π light as a further embodiment of the present invention. Specifically, the lamp housing 1 is PAR-shaped, the lamp housing 1 has a light reflecting layer 14 on an inner wall thereof, and the LED light-emitting strip 6 is attached to the metal wire 11 of the light column. core 5 and the electrical power conductor 3. In order to improve luminescent efficiency, a light reflecting plate 14a is provided at the bottom of the lamp housing 1, in order to reflect forward the light from the LED light-emitting strip 6 being directed towards the bottom to improve luminescent efficiency.
    [0078] Figure 4 is a schematic structure view of a highly efficient LED lamp with LED chips emitting 4π light as an even further embodiment of the present invention. The lamp housing 1 is T-shaped, and at least one LED light-emitting strip 6 is attached directly to the power conductor 3 and 3a of the core column 5. The power conductor 3a connected to the upper end of the emitting strip LED light 6 is curved, thus to prevent the light emitted from the LED light emitting strip 6 from generating shadow in the lamp housing 1 by the power conductor in parallel for this. The lamp housing 1 is provided with a layer of luminescent powder 26a on its inner wall, while the LED light-emitting strip does not have the luminescent powder layer. The electrical connector 8 is directly connected to the lamp housing 1. It is necessary to note in this example that the power conductor 3a can be considered as a curve support for the LED light-emitting strip 6.
    [0079] Figure 5 is a schematic view of a highly efficient LED lamp with LED chips emitting 4π light as an even further embodiment of the present invention. In this example, lamp housing 1 is type R reflective lamp housing, and a light reflecting layer 14 is provided on the inner wall of lamp housing 1. 4 LED light emitting strips 6, connected in series with each other, they are fixed and fixed to the core column 5 by the power conductor 3, the metal wire 11a of the core column and the metal wire 11 of the pillar 4.
    [0080] Figure 6 is a schematic front view of the LED light-emitting strip 6 on the highly efficient LED lamp with LED chips emitting 4π light as an embodiment of the present invention. The LED light-emitting strip 6 includes a transparent substrate 15, on which at least a series of LED chips 16 is provided. At least one series of 16 LED chips is connected in series in such a way that PN junctions have the same direction. An electrical connection wire 17 is provided between the LED chips 16. The two ends of the transparent substrate 15 are respectively the LED electrode conductors 18 and a fixing means 19. An end 20 of the electrode conductor 18 facing towards the chips LED 16 is exposed, to electrically connect the connection wire 21 and the LED chips 16.
    [0081] The transparent substrate 15 is made of glass, hard glass, quartz glass, ceramics or transparent plastics and so on. The fixing means 19, for the electrode conductor 18 at two ends of the LED light-emitting strip 6, is made of high temperature glue, plastic, silver paste or low melting glass. Since the LED lamp present employs a vacuum sealed chamber formed by vacuum sealing the LED lamp housing with the core column and the vacuum sealed chamber is filled with a gas having a low viscosity coefficient and a high coefficient of thermal conductivity to perform fast heat dissipation, unlike the LED light emitting strip in the prior art, the present invention is not limited to only the use of the very expensive transparent substrate such as sapphire, diamond to resist the high temperature generated by the emitting strips of LED light. Hereby, the transparent substrate of the present LED light-emitting strips 6 can be made using relatively inexpensive materials such as glass, hard glass, quartz glass, ceramics or transparent plastics, reducing the manufacturing cost of the light-emitting strips LED 6.
    [0082] The chips 16 connected in series are installed on the transparent substrate 15, they can be the identical or different luminescent colored LED chips, for example, emitting identical blue light, ultraviolet light or other monochromatic. It is also possible to emit different colored light, so to obtain different colored mixed light or white light. When a different number of LEDs having a different luminescent color is selected, it is possible to obtain a high color rendering index of white light having different color temperatures.
    [0083] Figure 7 is a schematic sectional view of the LED light-emitting strip 6 taken along a line AA of Figure 6. As shown in Figure 7, the LED chips 16 are fixed to the transparent substrate 15 via transparent glue 22. The chip substrates of the 16 LED chips are transparent. Light is emitted from the PN 24 junctions of the LED chip 16. A part of the emitted light can pass directly in one direction of the electrical connection wire 17, and another part of the emitted light (that is, the reflected light to the transparent substrate 15 per total reflection and the light originally directed to the transparent substrate 15) can pass through the chip substrate and the transparent substrate 15 of the light emitting strip. As shown in Figure 7, it can be known from the starting light 23 that LED chips 16 are capable of emitting 4π light, thereby significantly reducing the loss of light emitted from the PN junctions caused by reflection, multiple reflections and absorption within the 16 LED chips, finally greatly improving the luminescent efficiency of LED chips and external quantum efficiency. That is, the light-emitting efficiency of LED chips is improved. Transparent glue 22 is, for example, epoxy resin, modified resin or silica gel, and so on.
    [0084] Figure 8 is a schematic sectional view of the LED light-emitting strip 6 taken along a line A-A of Figure 6 in accordance with another embodiment of the present invention. In this embodiment, a transparent dielectric layer 25 having a high refractive index, high light transmittivity and high thermal conductivity is arranged on LED chips 16 and a transparent substrate surface 15 installed with LED chips 16, to increase the light transmissivity of the LED chips 16 in one direction of the connection wire 17 and protect the chips 16 and the electrical connection wire 17 from this. The transparent dielectric is silica gel, epoxy resin and plastics, for example.
    [0085] When LED chips emit blue light or ultraviolet light and luminescent powder is needed to convert the light into white light or another luminescent color, the LED light emitting strips 6 as shown in Figures 6, 7 and 8 additionally need a layer of luminescent powder on the outside of them. The luminescent powder layer can be attached closely to a surface of the LED light-emitting strip 6, or covered over an internal or external wall of the transparent dielectric tube outside the LED light-emitting strip 6. Certainly, the luminescent powder it can be mixed into the wall of the transparent dielectric tube (for example, made as a tube of luminescent powder), or it can be covered in the inner wall of the lamp housing 1, as shown as the phosphor powder layer 26a in Figure 4.
    [0086] Figure 9 is a schematic sectional view of the LED light-emitting strip having the luminescent powder layer as an embodiment. In this embodiment, a layer of uniform luminescent powder 26 is covered on outer surfaces around the LED chips 16 and the transparent substrate 15. In other words, a layer of uniform luminescent powder 26 is covered on the outer surfaces of the light-emitting strips of LED as shown in Figure 7.
    [0087] The luminescent powder layer 26 is made by mixing the luminescent powder and the transparent dielectric. The transparent dielectric is, for example, silicone glue, epoxy resin, plastics, transparent glue, transparent lacquer, high molecular polymer or similar.
    [0088] Figure 10 is a schematic sectional view of the LED light-emitting strip having the luminescent powder layer as another embodiment. In Figure 10, a transparent dielectric layer 25 is covered first on the LED chips 16 and a surface of the transparent substrate 15 installed with the chips (as shown in Figure 8), and then a layer of luminescent powder 26 is placed around the substrate. transparent 15 and the transparent dielectric layer 25.
    [0089] Figure 11 is a schematic sectional view of the LED light-emitting strip having the luminescent powder layer as another embodiment. In Figure 11, a transparent dielectric layer 25a is covered first around the transparent substrate 15 and a transparent dielectric layer 25 on the surface thereof installed with the LED chips 16, and then a layer of uniform luminescent powder 26 is placed around the layer transparent dielectric 25a.
    [0090] Figure 12 is a schematic sectional view of the LED light-emitting strip having the luminescent powder layer as another embodiment. In Figure 12, a transparent dielectric layer 25 is covered first around the chips 16 and the transparent substrate 15, and then a layer of uniform luminescent powder 26 is placed around the transparent dielectric layer 25.
    [0091] Figure 13 is a schematic sectional view of the LED light-emitting strip having the luminescent powder layer as another embodiment. In Figure 13, a layer of uniform luminescent powder 26 is covered first around the chips 16 and the transparent substrate 15, and then a transparent dielectric layer 25 is placed around the luminescent powder layer 26.
    [0092] In addition, a transparent tube can additionally be arranged outside the LED light-emitting strip 6 of Figure 6, to protect the LED chips. Of course, the LED light-emitting strip 6 can additionally be provided with a layer of luminescent powder. Figure 14 is a schematic front view of the LED light-emitting strip provided with a transparent outer tube as an embodiment. As shown in Figure 14, the LED light-emitting strip 27 includes a transparent outer tube 28 on which the transparent substrate 15 installed with the LED chips 16 is sealed. The electrodes of the LED chips 16 are conducted by the electrical power conductors 29 to both ends of the transparent tube 28, and the electrical power conductor 29 is sealed with the transparent tube 28 at the sealing location 30. In Figure 14, the electrode chips LED 16 can be LED chips having two different luminescent colors. For example, the LED chip 16 emits blue light, and the LED chip 16a emits red light. The LED chip 16a having different colors can be used to change the color temperature and the color rendering index of the emitted light.
    [0093] Figure 15 is a schematic structure view of the LED light-emitting strip 27 with LED chips emitting 4π light, taken along a BB line in Figure 14. In Figure 15, the LED chips 16 and the substrate transparent 15 of this are additionally provided with a transparent tube 28, which is made of glass, plastics or silicone glue. When the light-emitting strip 27 needs a layer of luminescent powder, the powder can be covered over the inner or outer wall of the transparent tube 28. Figure 15 shows an example in which the luminescent powder layer 32 is covered over the inner wall the transparent tube 28.
    [0094] As shown in Figure 15, the luminescent powder can also be mixed in the transparent dielectric of the transparent tube 28. That is, the luminescent powder is mixed with the transparent dielectric such as glass, plastics, or silicone glue, to produce the tube of transparent luminescent powder. In this way, it is not necessary to cover the luminescent powder layer 32 over the inner or outer wall of the transparent tube 28 again.
    [0095] As shown in Figure 15, materials 31 having a high coefficient of thermal conductivity, high refractive index and high light transmittivity can be filled between the transparent tube 28 and the LED chips as well as the transparent substrate 15, for example , transparent silicone glue, epoxy resin and plastics, and the like. When LED chips emit 4 π light, the light loss from light emitted from LED chips is very small at various dielectric interfaces, since the glass substrate, transparent glue and glass tube have refractive indexes close to one the other, thereby achieving a high luminescent efficiency, that is, a high light emission efficiency of the LED chips.
    [0096] Figure 16 is a schematic front view of an LED light-emitting strip with LED chips emitting 4π light according to another embodiment of the present invention. As shown in Figure 16, the LED light-emitting strip 33 with the LED chips emitting 4π light, the chip substrates of the LED chips are transparent. LED chips are high voltage LED chips, and each of the 34 high voltage LED chips includes at least two PN 35 LED junctions connected in series. At least one electrical connection wire 36 is between the respective PN junctions, to make a connection. Both ends of each high voltage LED chip have at least one 37 metal electrode for welding and wire joining, respectively. At least one electrical connection wire 38 may be provided between the various high voltage LED chips, and between the high voltage LED chips and the power conductor 18 of the high voltage LED light strip.
    [0097] As shown in Figure 16, at least one high voltage LED chip 34 of the LED light-emitting strip 33 can be of the same luminescent or different color. The light-emitting strip 33 can have a transparent dielectric layer on a surface of the chips, such as those in Figures 6 and 14. Additionally, a layer of luminescent powder can be arranged around the light-emitting strip 33.
    [0098] It should be understood that the LED light emitting strips 6, 27 and 33 above with the LED chips emitting 4π light can be used to produce the LED lamp as shown in Figures 1-5, or can be used individually as a light-emitting element.
    [0099] When used to produce an LED lamp, the positions of at least one LED light-emitting strip can be arranged as required, for example in the form of a column, V, W, cone and plane, and the like. For example, they can be arranged as shown in Figures 1-5 or Figures 17-20. When it is necessary to avoid generating shadow in the lamp housing caused by blocking the light emitted from the LED light-emitting strip by means of another LED light-emitting strip, the several of the at least one LED-emitting strip should intertwine with each other , as shown in Figure 18. The LED light-emitting strips are arranged in diagonal lines on multiple faces of a virtual polyhedral column or polyhedral truncated cone. In other words, the LED light-emitting strips are provided as a whole in a physical form of the polyhedral column or polyhedral truncated cone, while none of the LED light-emitting strips are located on the same plane. Figure 18 shows the square body arrangement of 4 LED light-emitting strips, while they are located respectively on the diagonal lines of the four faces as shown by the dashed line 41 of Figure 18.
    [00100] The light-emitting strips used 6, 27 and 33 can be of the same or different luminescent colors, thus to form lights having different luminescent colors, different color temperatures and different color reproduction rates. For example, as shown in Figure 17, light emitting strips 6, 27 or 33 including four blue LED light emitting chips and being covered with a layer of luminescent powder excited by blue light to generate yellow light, can be arranged around around the cone axis 39 between them, as a cone shape. Meanwhile, there is another LED light emitting strip 40 emitting another colored light. The other LED light emitting strip 40 for example emits red light, to change the relative light flow of both, that is, to obtain the white light LED lamp having different color temperature and color rendering index.
    [00101] Although some embodiments of the general inventive concept are illustrated and explained, it would be appreciated by those skilled in the art that modifications and variations can be made to these embodiments without departing from the principles and spirit of the general inventive concept of the exhibition, the extent of which is defined in their claims and equivalents.
    权利要求:
    Claims (13)
    [0001]
    1. LED lamp, comprising: an LED lamp housing (1); a core column (5) with an exhaust pipe (2); at least one LED light-emitting strip (6, 27, 33, 40) with LED chips (16, 16a, 34) emitting 4π light; an exciter (7); and an electrical connector (8), characterized by the fact that the LED lamp housing (1) is vacuum sealed with the core column (5) to form a vacuum sealed chamber (13), which is filled with a gas having a low coefficient of viscosity and a high coefficient of thermal conductivity, in which the LED light-emitting strips (6, 27, 33, 40) fixed on the core column (5) are housed in the vacuum sealed chamber, in that the LED light-emitting strip (6, 27, 33, 40) is electrically connected to the exciter (7), to the electrical connector (8), the electrical connector (8) used to be electrically connected to an external power source , in order to illuminate the LED light emitting strips (6, 27, 33, 40).
    [0002]
    2. LED lamp, according to claim 1, characterized by the fact that the core column (5) further comprises a support (42), and the support (42) and the LED light-emitting strip (6, 27, 33, 40) fixed to the support (42) are housed in the vacuum sealed chamber.
    [0003]
    3. LED lamp, according to claim 1 or 2, characterized by the fact that the LED lamp (1) is capable of transmitting light and connected to the electrical connector (8) directly or by a connection piece (9) , and a light reflection plate (14a) is provided at one end of the LED lamp housing (1) adjacent to the electrical connector (8), where the support (42) of the core column (5) comprises a conductor electrical power (3, 3a, 29), a pillar (4) and a metal wire (11, 11a) to fix the LED light emitting strip (6, 27, 33, 40), electrodes at two ends of the LED light-emitting strips (6, 27, 33, 40) are in turn electrically connected to the electrical connector (8) and the actuator (7) outside the vacuum sealed chamber through the electrical power conductor (3, 3a, 29).
    [0004]
    4. LED lamp according to claim 1 or 2, characterized by the fact that the gas having a low coefficient of viscosity and a high coefficient of thermal conductivity includes He, H2, or a mixed gas of He and H2, and , at room temperature, the gas has a gas pressure in the range of 50-1520 Torr.
    [0005]
    5. LED lamp according to claim 1 or 2, characterized by the fact that each of the at least one LED light-emitting strip (6, 27, 33, 40) has at least one series of LED chips (16, 16a, 34) connected in series in such a way that the PN junctions in the same have the same direction, and the number of LED chips (6, 27, 33, 40) is sufficiently large so that their drive voltage is close to an external drive voltage after the LED light-emitting strips (6, 27, 33, 40) are connected in series or in parallel and series, the total drive voltage is 20-100% of a peak value AC voltage or a DC power supply voltage.
    [0006]
    6. LED lamp, according to claim 1 or 2, characterized by the fact that the LED light-emitting strip (6, 27, 33, 40) are connected in series or in series and parallel, while operating in a bidirectional AC mode or a unidirectional DC mode, and the arrangement of the light-emitting strips is in the form of a V, W column, cone or plane.
    [0007]
    7. LED lamp, according to claim 1 or 2, characterized by the fact that the respective LED light-emitting strips (6, 27, 33, 40) intertwine with each other or the respective LED light-emitting strips (6 , 27, 33, 40) intertwine with each other and are located on the diagonal lines of the respective faces of a virtual polyhedral column or polyhedral truncated cone (41), so that any two strips of the LED light-emitting strips (6, 27, 33, 40) are not located on the same plane, to avoid generating shadow in the LED lamp housing (1) caused by the blocking of the light emitted by one of the LED light-emitting strips (6, 27, 33, 40) by means of another LED light-emitting strip (6, 27, 33, 40).
    [0008]
    8. LED lamp, according to claim 1 or 2, characterized by the fact that the LED light-emitting strip (6, 27, 33, 40) with the LED chips (16, 16a, 34) emitting light 4π, comprises: includes a transparent substrate (15); an electrode conducting device (17) of the LED chips provided at two ends of the transparent substrates (15); a fixing means (19) for fixing the electrode conducting device at both ends of the transparent substrate (15), and in which the fixing means (19) is made of high temperature glue, plastic, silver paste or glass with low melting point; and at least one series of LED chips (16, 16a, 34) installed on the transparent substrate (15) and connected in series so that the PN junctions (24, 35) in the same have the same direction, and the LED chips (16, 16a, 34) have transparent chip substrates, where LED chips (16, 16a, 34) are LED chips or high voltage LED chips with the same luminescent color or different luminescent colors, LEDs are independently and separately attached to the transparent substrate (15) by transparent glue (22), and the transparent substrate (15) of the LED light-emitting strip (16, 16a) is made of soft glass, hard glass, quartz glass, ceramic or clear plastic.
    [0009]
    9. LED lamp, according to claim 8, characterized by the fact that LED chips (16, 16a, 34) are blue or ultraviolet light LED chips, three-color RGB primary LED chips (16, 16a, 34) or multi-primary color LED chips (16, 16a, 34).
    [0010]
    10. LED lamp, according to claim 8, characterized by the fact that the LED lamp comprises at least one of the characteristics: (I) the LED lamp also comprises a layer of luminescent powder (26) arranged around the LED chips (16) and the transparent substrate (15) installed with the LED chips (16); (II) the LED lamp further comprises a first transparent dielectric layer (25) disposed on a surface of the transparent substrate (15) on which the LED chips (16) are installed and on the LED chips (16); (III) the LED lamp further comprises a layer of luminescent powder (26) arranged around the transparent dielectric layer (25) and the transparent substrate (15) installed with the LED chips (16); and (IV) the LED lamp comprises yet another transparent dielectric layer (25a) and a layer of luminescent powder (26), in turn, arranged around the first transparent dielectric layer (25) and the installed transparent substrate (15) with the LED chips (16).
    [0011]
    11. LED lamp, according to claim 8, characterized by the fact that it also comprises a transparent dielectric layer (25) and a luminescent powder layer (26), in turn, arranged around the LED chips (16 ) and the transparent substrate (15) installed with the LED chips (16) or further comprising a layer of luminescent powder (26) and a transparent dielectric layer (25), in turn, arranged around the LED chips (16 ) and the transparent substrate (15) installed with the LED chips (16).
    [0012]
    12. LED lamp according to claim 8, characterized by the fact that the luminescent powder layer (26, 26a) is made by mixing luminescent powder and transparent dielectric, the transparent dielectric comprising any of silicone glue, epoxy resin , plastics, clear glue, lacquer and clear polymer, or a combination thereof.
    [0013]
    13. LED lamp according to claim 8, characterized by the fact that the LED chips (16, 16a) and the transparent substrate (15) are closed by a transparent tube (28) or a transparent luminescent powder tube (28) on the outer side of the LED chips (16) and the transparent substrate (15), in which a layer of luminescent powder (32) is provided on an inner or outer wall of the transparent tube (28) and the transparent tube (28) is made of glass, plastic or silicone glue, where the LED lamp also comprises a dielectric (31) with a high coefficient of light transmittivity, a high coefficient of thermal conductivity and a high refractive index, between the transparent tube (28) and the LED chips (16, 16a) and the transparent substrate (15), in which the dielectric comprises transparent silicone glue, epoxy resin or plastic.
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    同族专利:
    公开号 | 公开日
    ES2531050T5|2021-05-04|
    US20130058080A1|2013-03-07|
    JP5689524B2|2015-03-25|
    HK1174089A1|2013-05-31|
    DK2535640T3|2015-03-30|
    MY163977A|2017-11-15|
    PL2535640T3|2015-04-30|
    ES2531050T3|2015-03-10|
    AU2011300999A1|2013-05-02|
    RU2013114922A|2014-10-20|
    RU2546469C2|2015-04-10|
    KR20130079524A|2013-07-10|
    EP2535640B2|2020-09-23|
    PT2535640E|2015-02-27|
    DK2535640T4|2020-09-28|
    PL2535640T5|2021-01-25|
    EP2535640A4|2013-11-20|
    WO2012031533A1|2012-03-15|
    JP2015053269A|2015-03-19|
    JP2013522850A|2013-06-13|
    BR112013005707A2|2017-03-14|
    CA2810658C|2015-02-10|
    CA2810658A1|2012-03-15|
    EP2535640A1|2012-12-19|
    SG188483A1|2013-04-30|
    US9261242B2|2016-02-16|
    EP2535640B1|2015-02-18|
    KR101510462B1|2015-04-08|
    AU2011300999B2|2014-12-18|
    DE202011110805U1|2016-07-14|
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    法律状态:
    2018-03-27| B15K| Others concerning applications: alteration of classification|Ipc: F21V 29/70 (2015.01), F21K 9/232 (2016.01), F21K 9 |
    2018-12-26| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-07-23| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2020-04-28| B07A| Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]|
    2021-03-09| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-03-30| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 01/09/2011, OBSERVADAS AS CONDICOES LEGAIS. |
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